(San Diego, CA USA), March 26, 2024 - Accelink has announced their successful collaboration with Cisco on a 1.6T OSFP-XD silicon photonics-based transceiver. Leveraging the strengths of both industry leaders, this marks a significant leap forward in silicon photonic based optical module technology, enabling higher speeds in data centers for cloud and Artificial Intelligence (AI) applications.
3月26日，光迅科技聯(lián)合思科成功推出1.6T OSFP-XD硅光模塊。雙方強強聯(lián)手，標(biāo)志著基于硅光的光模塊技術(shù)取得重大飛躍，以推動云和人工智能（AI）應(yīng)用的數(shù)據(jù)中心實現(xiàn)更高的傳輸速率。
Cisco, with its extensive experience in silicon photonics Photonic Integrated Circuits (PICs), has joined forces with Accelink, a global leader in the design and manufacturing of high-speed optical modules. This partnership leverages Cisco's proven ability to scale coherent silicon photonics for data center volumes with Accelink's unparalleled capabilities in optical module innovation. Together, they have spearheaded the development of this 1.6T OSFP-XD silicon photonic-based transceiver, demonstrating an unmatched level of innovation and commitment.
思科憑借其在硅光子集成電路（PIC）方面的豐富經(jīng)驗，與全球高速光模塊研發(fā)和制造先行者—光迅科技強強聯(lián)手。這次戰(zhàn)略合作展現(xiàn)了思科為數(shù)據(jù)中心容量擴展相干硅光技術(shù)的能力，以及光迅科技在光模塊技術(shù)的創(chuàng)新能力。雙方攜手率先開發(fā)的1.6T OSFP-XD硅光模塊，展示了其領(lǐng)先的創(chuàng)新水平。
Figure1. 1.6T OSFP-XD silicon photonic-based transceiver
“In collaboration with Cisco, Accelink is delighted to contribute to pushing data transmission boundaries through our joint expertise in Cisco’s silicon photonics” said Dr. Ethan Hu, CEO of Accelink. “We extend our heartfelt gratitude to Cisco for their invaluable partnership, which has enabled us to achieve a pinnacle of achievement in high-speed interconnectivity, paving the way for seamless adoption of emerging applications such as AI and ML in diverse networking environments.”
光迅科技總經(jīng)理胡強高博士表示：“我們很高興與思科合作，通過光迅科技和思科在硅光方面的專業(yè)知識，為突破數(shù)據(jù)傳輸邊界做出貢獻。”“我們也衷心感謝思科寶貴的合作伙伴關(guān)系，使我們在高速互聯(lián)方面處于領(lǐng)先地位，為在各種網(wǎng)絡(luò)環(huán)境中無縫采用人工智能和機器學(xué)習(xí)等新興應(yīng)用鋪平道路。”
The 1.6T OSFP-XD DR8 silicon photonics transceiver represents a major technological milestone, featuring advanced CMOS technology for highly integrated, simplified packaging and mass production. Meeting the rigorous OSFP-XD MSA and CMIS protocol standards, the module boasts an electrical interface with 16 channels at a 100Gb/s signal rate each, alongside an optical interface with 8 channels at a 200Gb/s signal rate each, achieving a transmission distance of 500m with exceptional margin and efficiency. This silicon photonics-based transceiver provides high-speed interconnectivity in areas such as data centers and cloud computing due to its ultra-high transmission rate and reliability.
1.6T OSFP-XD DR8硅光模塊是一個重要的技術(shù)里程碑，采用先進的CMOS技術(shù)實現(xiàn)高度集成、簡化封裝和大規(guī)模生產(chǎn)。該模塊符合嚴(yán)格的OSFP-XD MSA和CMIS協(xié)議標(biāo)準(zhǔn)，電接口采用16個通道，單通道信號速率100Gb/s；光接口采用8通道，單通道信號速率200Gb/s，以優(yōu)異的裕度和效率實現(xiàn)了距離500米的數(shù)據(jù)傳輸。這種基于硅光的光收發(fā)模塊因其超高的傳輸速率和可靠性，可在數(shù)據(jù)中心和云計算等領(lǐng)域?qū)崿F(xiàn)高速互連。
Figure2. Transmitter Eye Diagram of the 1.6T OSFP-XD Transceiver
“We are thrilled to collaborate with the team at Accelink to bring advanced optical solutions to market,” said Tom Williams, Senior Director of Marketing for Cisco. “We believe our high-performing silicon photonics that can be manufactured in high volume will play an important role in building next generation networks for AI infrastructures.”
思科市場營銷高級總監(jiān)Tom Williams表示：“我們很高興能與光迅科技合作，將先進的光學(xué)解決方案推向市場。”“我們相信，我們推出的可以大批量生產(chǎn)的高性能硅光產(chǎn)品將在構(gòu)建下一代人工智能基礎(chǔ)設(shè)施網(wǎng)絡(luò)方面發(fā)揮重要作用。”
Accelink will demonstrate this innovative product at the OFC (Optical Communication Conference) in in San Diego, March 24-28 at Booth# 2247. This collaboration not only demonstrates Cisco’s global leadership and influence in silicon photonics PIC technology but also confirms Accelink’s leading position in the optical transceiver market. Both companies see opportunities for further collaboration to solve the needs of network operators for reliable high-speed optical technology.
光迅科將于3月26日至28日在圣地亞哥舉行的OFC（展位號2247）展示這一創(chuàng)新產(chǎn)品。此次合作不僅展示了思科在硅光PIC技術(shù)方面的全球領(lǐng)導(dǎo)力和影響力，也證實了光迅科技在光收發(fā)模塊市場的領(lǐng)先地位。雙方將進一步緊密合作，共同滿足網(wǎng)絡(luò)運營商對可靠高速光學(xué)技術(shù)的需求。
